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Under The Hood: TI 65-nm chip at heart of Nokia 2610
By Gregory A. Quirk, Semiconductor Insights
Source: EE Times

Posted: 12/19/2006
Rating: 3.5 (Good!)

The Nokia 2610 is an entry-level dual band cell phone for the GSM 900 and 1800 network. Compared to other entry-level phones in the $90 price range, the 2610 seems to be a bit short on features. While it offers basic functionality, and is capable of connecting to the Internet to view websites and receive e-mail, it does not have a digital camera. While a digital camera is not necessary, and not having one is better than having a poor quality solution, it is almost like the phone is missing something.

The display offers 65,000 colors with 128- x 128-pixel resolution. Unfortunately the display is a CSTN, which makes it more difficult to see in daylight conditions. The phone measures 104 x 43 x 18 mm and weighs 79 g. The battery is a 970-mAh Li-Ion that provides 320 minutes of talk time and 380 hours of standby time.

There are a few interesting components found on the pc board of this particular phone. Part of the reason they are interesting is because they are not publicly available, or at least little to no information can be found out about them.

The most interesting component is the 4377401. There are no distinguishing markings on this device to indicate the manufacturer or what the function is. However, further investigation of the device reveals some very interesting aspects. First, the die markings clearly identify this as a Texas Instruments device.

Figure 1: Die markings found on the Texas Instruments 65-nm baseband processor.

TI has produced a number of components for Nokia without placing any of their markings on the package. For example, the Nokia 7610 contained the 4377007, which was a TI baseband processor. But the fact that this is a TI device is not nearly as interesting as what was unveiled with a cross sectional analysis.

Figure 2: TEM cross section of the Texas Instruments 65-nm baseband processor.

The SRAM cell size confirmed a process lithography of 65 nm, the first device using this process to come from TI. This is quite an accomplishment and shows TI to be the first manufacturer to make use of 65-nm process technology for a low-cost logic device. The die size measures 4.0 x 3.3 mm for a total of 13.2mm2.

The Samsung device is a NAND flash solution. It appears to be a 4-Mbyte NAND flash. Due to the programs pre-installed on the phone, there are 3Mbytes of memory left for use. This is the same device that was used on the Nokia 6610i cell phone.

The RF component has the part name of Hugin+. A quick search seems to indicate that this is supplied by Infineon, due to the associated Infineon part number PMB3258.

Figure 3:Full pc-board layout of 2610.

Related Articles:

The mobile handset tradeoff: size and cost or bandwidth

Ensuring design success at 65 nm

Squeezing operational life out of a shrinking energy capsule

4 Gbit NAND built at 65 nm


 

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